Modeling and Simulation

This research program addresses the challenges of process optimization through modeling and simulation. Key quality indicators for AM-made parts include: dimensional tolerances, residual stresses/deformation, residual porosity (volume fraction/size/distribution), microstructure (phase content, grain size/morphology/distribution), chemistry and surface finish. The vast number of interdependent process parameters in AM significantly limits the efficacy of a conventional trial-and-error approach to process optimization and design.

Ripple-angle θ comparison of a track with process parameter 195 W and 800 mm/s, (a) experimental result, (b) numerical result.

Ripple-angle θ comparison of a track with process parameter 195 W and 800 mm/s, (a) experimental result, (b) numerical result.

Measured and predicted 3D profiles and the associated transverse cross-section contours of the multi-track/layer builds (DED).

Measured and predicted 3D profiles and the associated transverse cross-section contours of the multi-track/layer builds (DED).

Advanced multi-physics numerical models of various AM technologies developed at MSAM are being enhanced and validated to offer the potential to significantly compliment the conventional trial-and-error method, leading to breakthroughs in process optimization and technology development.

The Coupled Structural Toplogy Optimization and Support Topology Optimization for Laser Powder Bed Fusion (L-PBF) Additive Manufacturing.

The Coupled Structural Toplogy Optimization and Support Topology Optimization for Laser Powder Bed Fusion (L-PBF) Additive Manufacturing.

In addition, different materials and different AM processes pose different manufacturing constraints on the lattice structures that can be obtained with acceptable quality. There is a critical need to link lattice structure design with AM capabilities and constraints to ensure that the designed lattice structure can be achieved for a given process technology and meet the designed objectives. MSAM researchers are working on this important research topic.

Simulated randomly packing powder bed (a) and the associated thermal field distribution (b)

Simulated randomly packing powder bed (a) and the associated thermal field distribution (b)